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Freescale Semiconductor Technical Data Document Number: MDE6IC9120N Rev. 0, 11/2009 RF LDMOS Wideband Integrated Power Amplifiers The MDE6IC9120N/GN wideband integrated circuit is designed with on - chip matching that makes it usable from 920 to 960 MHz. This multi - stage structure is rated for 26 to 32 Volt operation and covers all typical cellular base station modulation formats. * Typical Doherty Single - Carrier W - CDMA Performance: VDD = 28 Volts, IDQ1A = IDQ1B = 90 mA, IDQ2A = 550 mA, VG2B = 1.6 Vdc, Pout = 25 Watts Avg., IQ Magnitude Clipping, Channel Bandwidth = 3.84 MHz, Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF. Frequency 920 MHz 940 MHz 960 MHz Gps (dB) 32.5 32.0 31.3 PAE (%) 38.4 38.0 37.7 Output PAR (dB) 6.6 6.7 7.0 ACPR (dBc) - 39.0 - 40.4 - 39.6 MDE6IC9120NR1 MDE6IC9120GNR1 920 - 960 MHz, 25 W AVG., 28 V SINGLE W - CDMA RF LDMOS WIDEBAND INTEGRATED POWER AMPLIFIERS * Capable of Handling 10:1 VSWR, @ 32 Vdc, 940 MHz, 146 Watts CW Output Power (3 dB Input Overdrive from Rated Pout), Designed for Enhanced Ruggedness * Stable into a 5:1 VSWR. All Spurs Below - 60 dBc @ 100 mW to 120 Watts CW Pout * Typical Pout @ 1 dB Compression Point ] 120 Watts CW Features * Production Tested in a Symmetrical Doherty Configuration * 100% PAR Tested for Guaranteed Output Power Capability * Characterized with Series Equivalent Large - Signal Impedance Parameters and Common Source S - Parameters * On - Chip Matching (50 Ohm Input, DC Blocked) * Integrated Quiescent Current Temperature Compensation with Enable/Disable Function (1) * Integrated ESD Protection * 225C Capable Plastic Package * RoHS Compliant * In Tape and Reel. R1 Suffix = 500 Units per 44 mm, 13 inch Reel VGS1A RFinA CARRIER (2) RFout1/VDS2A VGS1A GND RFinA GND GND VGS2A VDS1A VDS1B VGS2B GND GND RFinB GND VGS1B CASE 1866 - 02 TO - 270 WBL - 16 PLASTIC MDE6IC9120NR1 CASE 1867 - 02 TO - 270 WBL - 16 GULL PLASTIC MDE6IC9120GNR1 VGS2A VDS1A VDS1B VGS2B RFinB VGS1B Quiescent Current Temperature Compensation (1) PEAKING (2) RFout2/VDS2B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 16 RFout1/VDS2A 15 RFout2/VDS2B (Top View) Quiescent Current Temperature Compensation (1) Note: Exposed backside of the package is the source terminal for the transistors. Figure 1. Functional Block Diagram Figure 2. Pin Connections 1. Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family and to AN1987, Quiescent Current Control for the RF Integrated Circuit Device Family. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1977 or AN1987. 2. Peaking and Carrier orientation is determined by the test fixture design. (c) Freescale Semiconductor, Inc., 2009. All rights reserved. MDE6IC9120NR1 MDE6IC9120GNR1 1 RF Device Data Freescale Semiconductor Table 1. Maximum Ratings Rating Drain- Source Voltage Gate- Source Voltage Operating Voltage Storage Temperature Range Case Operating Temperature Operating Junction Temperature (1,2) Input Power Symbol VDSS VGS VDD Tstg TC TJ Pin Value - 0.5, +66 - 0.5, +10 32, +0 - 65 to +150 150 225 30 Unit Vdc Vdc Vdc C C C dBm Table 2. Thermal Characteristics Characteristic Final Doherty Application Thermal Resistance, Junction to Case Case Temperature 80C, Pout = 30 W CW Stage 1A, 27 Vdc, IDQ1A = 90 mA Stage 1B, 27 Vdc, IDQ1B = 90 mA Stage 2A, 27 Vdc, IDQ2A = 550 mA Stage 2B, 27 Vdc, VG2B = 2.5 Vdc RJC 6.0 4.9 1.3 0.95 C/W Symbol Value (2,3) Unit Table 3. ESD Protection Characteristics Test Methodology Human Body Model (per JESD22 - A114) Machine Model (per EIA/JESD22 - A115) Charge Device Model (per JESD22 - C101) Class 1B (Minimum) A (Minimum) III (Minimum) Table 4. Moisture Sensitivity Level Test Methodology Per JESD22 - A113, IPC/JEDEC J - STD - 020 Rating 3 Package Peak Temperature 260 Unit C 1. Continuous use at maximum temperature will affect MTTF. 2. MTTF calculator available at http://www.freescale.com/rf. Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product. 3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1955. MDE6IC9120NR1 MDE6IC9120GNR1 2 RF Device Data Freescale Semiconductor Table 5. Electrical Characteristics (TA = 25C unless otherwise noted) Characteristic Stage 1 -- Off Characteristics (1) Zero Gate Voltage Drain Leakage Current (VDS = 66 Vdc, VGS = 0 Vdc) Zero Gate Voltage Drain Leakage Current (VDS = 28 Vdc, VGS = 0 Vdc) Gate- Source Leakage Current (VGS = 1.5 Vdc, VDS = 0 Vdc) Stage 1 -- On Characteristics (1) Gate Threshold Voltage (VDS = 10 Vdc, ID = 20 Adc) Gate Quiescent Voltage (VDS = 28 Vdc, IDQ1A = IDQ1B = 90 mA) Fixture Gate Quiescent Voltage (VDD = 28 Vdc, IDQ1A = IDQ1B = 90 mA, Measured in Functional Test) Stage 2 -- Off Characteristics (1) Zero Gate Voltage Drain Leakage Current (VDS = 66 Vdc, VGS = 0 Vdc) Zero Gate Voltage Drain Leakage Current (VDS = 28 Vdc, VGS = 0 Vdc) Gate- Source Leakage Current (VGS = 1.5 Vdc, VDS = 0 Vdc) Stage 2 -- On Characteristics (1) Gate Threshold Voltage (VDS = 10 Vdc, ID = 160 Adc) Gate Quiescent Voltage (VDS = 28 Vdc, IDQ2A = 550 mA) Fixture Gate Quiescent Voltage (VDD = 28 Vdc, IDQ2A = 550 mA, Measured in Functional Test) Drain- Source On - Voltage (VGS = 10 Vdc, ID = 407 mA) VGS(th) VGS(Q) VGG(Q) VDS(on) 1 -- 5.8 0.15 1.7 2.1 6.5 0.3 3 -- 7.2 0.8 Vdc Vdc Vdc Vdc IDSS IDSS IGSS -- -- -- -- -- -- 10 1 1 Adc Adc Adc VGS(th) VGS(Q) VGG(Q) 1 -- 7.4 1.7 2.5 8.1 3 -- 8.8 Vdc Vdc Vdc IDSS IDSS IGSS -- -- -- -- -- -- 10 1 1 Adc Adc Adc Symbol Min Typ Max Unit Functional Tests (2,3,4) (In Freescale Doherty Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ1A = IDQ1B = 90 mA, IDQ2A = 550 mA, VG2B = 1.6 Vdc, Pout = 25 W Avg., f = 940 MHz, Single- Carrier W - CDMA, IQ Magnitude Clipping, Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @ 5 MHz Offset. Power Gain Power Added Efficiency Output Peak - to - Average Ratio @ 0.01% Probability on CCDF Adjacent Channel Power Ratio Gps PAE PAR ACPR 30.0 36.0 5.8 -- 32.0 38.0 6.7 - 40.4 36.0 -- -- - 36.0 dB % dB dBc Typical Broadband Performance (3) (In Freescale Doherty Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ1A = IDQ1B = 90 mA, IDQ2A = 550 mA, VG2B = 1.6 Vdc, Pout = 25 W Avg., Single - Carrier W - CDMA, IQ Magnitude Clipping, Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @ 5 MHz Offset Frequency 920 MHz 940 MHz 960 MHz 1. 2. 3. 4. Gps (dB) 32.5 32.0 31.3 PAE (%) 38.4 38.0 37.7 Output PAR (dB) 6.6 6.7 7.0 ACPR (dBc) - 39.0 - 40.4 - 39.6 Each side of device measured separately. Part internally matched both on input and output. Measurement made with device in a Symmetrical Doherty configuration. Measurement made with device in straight lead configuration before any lead forming operation is applied. (continued) MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor 3 Table 5. Electrical Characteristics (TA = 25C unless otherwise noted) (continued) Characteristic Symbol Min Typ Max Unit Typical Performances (1) (In Freescale Doherty Test Fixture, 50 ohm system) VDD = 28 Vdc, IDQ1A = IDQ1B = 90 mA, IDQ2A = 550 mA, VG2B = 1.6 Vdc, 920 - 960 MHz Bandwidth Pout @ 1 dB Compression Point, CW IMD Symmetry @ 90 W PEP, Pout where IMD Third Order Intermodulation 30 dBc (Delta IMD Third Order Intermodulation between Upper and Lower Sidebands > 2 dB) VBW Resonance Point (IMD Third Order Intermodulation Inflection Point) Quiescent Current Accuracy over Temperature (2) with 4.3 k Gate Feed Resistors ( - 30 to 85C) Gain Flatness in 40 MHz Bandwidth @ Pout = 25 W Avg. Gain Variation over Temperature ( - 30C to +85C) Output Power Variation over Temperature ( - 30C to +85C) Stage 1 Stage 2 P1dB IMDsym -- -- 120 8 -- -- W MHz VBWres IQT GF G P1dB -- -- -- -- -- -- 50 0.02 0.03 1.2 0.04 0.02 -- -- -- -- -- -- MHz % dB dB/C dBm/C 1. Measurement made with device in a Symmetrical Doherty configuration. 2. Refer to AN1977, Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family and to AN1987, Quiescent Current Control for the RF Integrated Circuit Device Family. Go to http://www.freescale.com/rf. Select Documentation/Application Notes - AN1977 or AN1987. MDE6IC9120NR1 MDE6IC9120GNR1 4 RF Device Data Freescale Semiconductor R3 VG1 C3 MDE6IC9120N Rev 2A VD2 C19 C13 C27 R5 C9 C5 C6 C7 R1 C12 VD1 VG2 C2 C28 C10 C8 R6 C1 C21 C23 C25 C26 C24 C22 C17 VG2 VD1 Coupler 1 C11 CUT OUT AREA C18 C14 R4 VG1 C4 VD2 C20 Note: Component numbers C15, C16 and R2 are not used. Figure 3. MDE6IC9120NR1(GNR1) Test Circuit Component Layout Table 6. MDE6IC9120NR1(GNR1) Test Circuit Component Designations and Values Part C1, C2, C5, C6, C7, C8 C3, C4, C9, C10, C11, C12 C13, C14, C27, C28 C17, C18 C19, C20 C21, C22 C23, C24 C25, C26 Coupler 1 R1 R3, R4, R5, R6 PCB Description 0.01 F, 50 V Chip Capacitors 1.0 F, 35 V Chip Capacitors 39.0 pF Chip Capacitors 10.0 F, 35 V Chip Capacitors 220 F, 50 V Electrolytic Capacitors 15.0 pF Chip Capacitors 1.6 pF Chip Capacitors 2.7 pF Chip Capacitors 50 , 3 dB Hybrid Coupler 50 , 10 W Termination 4.3 K, 1/4 W Chip Resistors 0.020, r = 3.50 Part Number GCM2195C1H103JA16D GRM32RR71H105KA01K ATC600F390JT250XT GRM55DR61H106KA88L EMVY500ADA221MJA0G ATC600F150GT250XT ATC600F1R6JT250XT ATC600F2R7JT250XT GSC362- HYB0900 RFP - 060120A15Z50- 2 CRCW12064K30FKEA RO4350B Manufacturer Murata Murata ATC Murata Nippon Chemi - Con ATC ATC ATC Soshin Anaren Vishay Rogers MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor 5 Single-ended l 4 l 4 Quadrature combined l 4 Doherty l 2 l 2 Push-pull Figure 4. Possible Circuit Topologies MDE6IC9120NR1 MDE6IC9120GNR1 6 RF Device Data Freescale Semiconductor TYPICAL CHARACTERISTICS PAE, POWER ADDED EFFICIENCY (%) 0 ACPR (dBc) PARC (dB) ACPR (dBc) -1 -2 -3 -20 PAE, POWER ADDED EFFICIENCY (%) -25 -30 -35 -40 -45 -50 40 35 Gps, POWER GAIN (dB) PAE 30 25 20 15 10 800 PARC ACPR 825 850 875 900 925 950 975 -50 1000 Gps 20 IDQ1A = IDQ1B = 90 mA, IDQ2A = 550 mA VG2B = 1.6 Vdc, Single-Carrier W-CDMA, 3.84 MHz Channel Bandwidth, Input Signal PAR = 7.5 dB 10 @ 0.01% Probability on CCDF -30 -40 40 VDD = 28 Vdc, Pout = 25 W (Avg.) 30 f, FREQUENCY (MHz) Figure 5. Output Peak - to - Average Ratio Compression (PARC) Broadband Performance @ Pout = 25 Watts Avg. -10 -20 -30 -40 -50 -60 -70 1 10 TWO-TONE SPACING (MHz) 100 IM5-U IM5-L IM7-L IM7-U VDD = 28 Vdc, Pout = 90 W (PEP), IDQ1A = IDQ1B = 90 mA IDQ2A = 550 mA, VG2B = 1.6 Vdc, Two-Tone Measurements (f1 + f2)/2 = Center Frequency of 940 MHz IM3-U IM3-L IMD, INTERMODULATION DISTORTION (dBc) Figure 6. Intermodulation Distortion Products versus Two - Tone Spacing 50 OUTPUT COMPRESSION AT 0.01% PROBABILITY ON CCDF (dB) 45 Gps, POWER GAIN (dB) 40 35 30 25 20 1 0 -1 -2 -3 -4 -5 10 VDD = 28 Vdc, IDQ1A = IDQ1B = 90 mA, IDQ2A = 550 mA VG2B = 1.6 Vdc, f = 940 MHz -1 dB = 33.01 W -2 dB = 50.78 W 60 PAE 50 ACPR 40 -3 dB = 67.13 W Gps PARC Single-Carrier W-CDMA, 3.84 MHz Channel Bandwidth, Input Signal PAR = 7.5 dB @ 0.01% PARC Probability on CCDF 20 30 40 50 60 70 80 90 30 20 10 0 100 Pout, OUTPUT POWER (WATTS) Figure 7. Output Peak - to - Average Ratio Compression (PARC) versus Output Power MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor 7 TYPICAL CHARACTERISTICS 36 35 Gps, POWER GAIN (dB) 34 33 32 31 30 1 ACPR 10 Pout, OUTPUT POWER (WATTS) AVG. 3.84 MHz Channel Bandwidth Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF 920 MHz 960 MHz 940 MHz 0 100 VDD = 28 Vdc, IDQ1A = IDQ1B = 90 mA, IDQ2A = 550 mA VG2B = 1.6 Vdc, Single-Carrier, W-CDMA 920 MHz 940 MHz 960 MHz 940 MHz 960 MHz PAE 60 PAE, POWER ADDED EFFICIENCY (%) 50 40 30 20 10 -20 -25 -30 -35 -40 -45 -50 ACPR (dBc) +ACPR in 3.84 MHz Integrated BW 1.8 3.6 Gps Figure 8. Single - Carrier W - CDMA Power Gain, Power Added Efficiency and ACPR versus Output Power 40 35 30 GAIN (dB) 25 20 15 10 IRL 5 0 600 -30 -35 1200 VDD = 28 Vdc, Pin = 0 dBm IDQ1A = IDQ1B = 90 mA IDQ2A = 550 mA, VG2B = 1.6 Vdc Gain 5 0 -5 -10 -15 -20 -25 IRL (dB) 3.84 MHz Channel BW 0 700 800 900 1000 1100 f, FREQUENCY (MHz) Figure 9. Broadband Frequency Response W - CDMA TEST SIGNAL 100 10 PROBABILITY (%) 1 Input Signal 0.1 (dB) 0.01 0.001 0.0001 0 W-CDMA. ACPR Measured in 3.84 MHz Channel Bandwidth @ 5 MHz Offset. Input Signal PAR = 7.5 dB @ 0.01% Probability on CCDF 1 2 3 4 5 6 7 8 9 10 10 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -9 -7.2 -5.4 -3.6 -1.8 5.4 7.2 9 f, FREQUENCY (MHz) -ACPR in 3.84 MHz Integrated BW PEAK-TO-AVERAGE (dB) Figure 10. CCDF W - CDMA IQ Magnitude Clipping, Single - Carrier Test Signal MDE6IC9120NR1 MDE6IC9120GNR1 8 Figure 11. Single - Carrier W - CDMA Spectrum RF Device Data Freescale Semiconductor VDD = 28 Vdc, IDQ1A = IDQB = 90 mA, IDQ2A = 550 mA, VG2B = 1.6 Vdc, Pout = 25 W Avg. f MHz 820 840 860 880 900 920 940 960 980 Zin = Zin W 56.02 - j0.10 57.03 - j2.95 57.27 - j6.01 57.45 - j8.80 57.56 - j12.21 56.66 - j15.98 55.81 - j19.90 53.45 - j23.91 51.34 - j27.40 Zload W 3.61 + j1.78 3.11 + j1.50 2.65 + j1.56 2.28 + j1.81 2.07 + j2.11 1.87 + j2.40 1.77 + j2.64 1.75 + j2.89 1.58 + j3.12 Note: Measured with Peaking side open. Device input impedance as measured from gate to ground. Test circuit impedance as measured from drain to ground. Zload = Device Under Test Output Matching Network Z in Z load Figure 12. Series Equivalent Input and Load Impedance -- Carrier Side VDD = 28 Vdc, IDQ1A = IDQB = 90 mA, IDQ2A = 550 mA, VG2B = 1.6 Vdc, Pout = 25 W Avg. f MHz 820 840 860 880 900 920 940 960 980 Zin = Zin W 56.02 - j0.10 57.03 - j2.95 57.27 - j6.01 57.45 - j8.80 57.56 - j12.21 56.66 - j15.98 55.81 - j19.90 53.45 - j23.91 51.34 - j27.40 Zload W 2.56 - j3.47 2.36 - j2.95 2.15 - j2.39 2.02 - j1.85 1.90 - j1.32 1.72 - j0.85 1.60 - j0.39 1.47 + j0.12 1.30 + j0.66 Note: Measured with Carrier side open. Device input impedance as measured from gate to ground. Test circuit impedance as measured from drain to ground. Zload = Device Under Test Output Matching Network Z in Z load Figure 13. Series Equivalent Input and Load Impedance -- Peaking Side MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor 9 ALTERNATIVE PEAK TUNE LOAD PULL CHARACTERISTICS VDD = 28 Vdc, IDQ1A = 90 mA, IDQ2A = 550 mA, Pulsed CW, 10 sec(on), 10% Duty Cycle 56 55 Pout, OUTPUT POWER (dBm) 54 53 52 51 50 49 48 47 46 45 9 10 11 12 13 14 15 16 17 18 19 20 Pin, INPUT POWER (dBm) NOTE: Load Pull Test Fixture Tuned for Peak P1dB Output Power @ 28 V f (MHz) 920 940 960 P1dB Watts 98.4 98.9 95.5 dBm 49.9 50.0 49.8 P3dB Watts 123 123 118 dBm 50.9 50.9 50.7 940 MHz 960 MHz 920 MHz 960 MHz 920 MHz Actual Ideal 940 MHz Test Impedances per Compression Level f (MHz) 920 940 960 P1dB P1dB P1dB Zsource 49.53 - j0.96 48.85 - j0.63 51.26 - j0.82 Zload 1.59 - j0.84 1.75 - j0.53 1.72 - j0.33 Figure 14. Pulsed CW Output Power versus Input Power @ 28 V NOTE: Measurement made on the Class AB, carrier side of the device. MDE6IC9120NR1 MDE6IC9120GNR1 10 RF Device Data Freescale Semiconductor PACKAGE DIMENSIONS MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor 11 MDE6IC9120NR1 MDE6IC9120GNR1 12 RF Device Data Freescale Semiconductor MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor 13 MDE6IC9120NR1 MDE6IC9120GNR1 14 RF Device Data Freescale Semiconductor MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor 15 MDE6IC9120NR1 MDE6IC9120GNR1 16 RF Device Data Freescale Semiconductor PRODUCT DOCUMENTATION Refer to the following documents to aid your design process. Application Notes * AN1955: Thermal Measurement Methodology of RF Power Amplifiers * AN1977: Quiescent Current Thermal Tracking Circuit in the RF Integrated Circuit Family * AN1987: Quiescent Current Control for the RF Integrated Circuit Device Family Engineering Bulletins * EB212: Using Data Sheet Impedances for RF LDMOS Devices Software * Electromigration MTTF Calculator * RF High Power Model * .s2p File For Software and Tools, do a Part Number search at http://www.freescale.com, and select the "Part Number" link. Go to the Software & Tools tab on the part's Product Summary page to download the respective tool. REVISION HISTORY The following table summarizes revisions to this document. Revision 0 Date Nov. 2009 * Initial Release of Data Sheet Description MDE6IC9120NR1 MDE6IC9120GNR1 RF Device Data Freescale Semiconductor 17 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 1 - 800- 521- 6274 or +1 - 480- 768- 2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1 - 8 - 1, Shimo - Meguro, Meguro - ku, Tokyo 153 - 0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 10 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1 - 800- 441- 2447 or +1 - 303- 675- 2140 Fax: +1 - 303- 675- 2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescalet and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2009. All rights reserved. MDE6IC9120NR1 MDE6IC9120GNR1 Rev. 18 0, 11/2009 Document Number: MDE6IC9120N RF Device Data Freescale Semiconductor |
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